As the electronics industry pushes the boundaries of power density—driven by the relentless growth of AI data centers, electric vehicle (EV) power modules, and high-performance computing—thermal management has become the primary bottleneck for reliability.
From March 9–12, 2026, in San Jose, California, Indium Corporation will address these challenges at SEMI-THERM 2026. At Booth #303, the company will showcase its latest innovations in liquid metal technology and metal Thermal Interface Materials (TIMs) designed to solve the heat dissipation demands of next-generation hardware.
The Portfolio: Advanced Thermal Solutions for 1,000W+ Applications
Indium Corporation’s 2026 showcase focuses on high-conductivity materials that outperform traditional thermal greases and pads, offering superior longevity and stability.
1. Liquid Metal TIMs: The Gold Standard for Conductivity
Designed for both TIM0 (die-level) and TIM1 (lid-level) applications, these alloys (including InGa and InGaSn) offer:
- Extreme Wetting: Exceptional ability to bond with both metallic and non-metallic surfaces.
- Rapid Dissipation: Low interfacial resistance ensures heat is pulled away from the silicon immediately.
- Longevity: Formulated to enhance end-product reliability in high-stress environments.
2. Solder TIMs: Built for Power-Dense Devices
As chips exceed 1,000 watts, traditional cooling solutions often fail. Indium’s Solder TIMs are optimized for BGA packages and provide:
- Void-Free Performance: Reliable through multiple reflow cycles.
- Stability: Unlike fluidic solutions, they prevent “pump-out” or “bake-out” failures.
- Sustainability: Fully RoHS compliant, these materials help reduce cooling fan size and heat-sink mass, supporting greener electronics design.
3. Heat-Spring®: The Compressible Metal Solution
For TIM2 (heatsink-to-lid) applications, Heat-Spring® offers a non-reflow, compressible alternative to non-metal pads.
- Performance: Pure indium versions deliver a massive 86W/mK thermal conductivity.
- Mechanical Integrity: Being a solid metal, it avoids the mess and degradation of greases.
- Circular Economy: Supported by Indium Corporation’s metals and compounds reclaim and recycle program.
4. Heat-Spring® HSx: Solving for Die Warpage
Large-area dies often suffer from warpage of 200 microns or more, creating uneven thermal contact. The HSx variant is specifically engineered for this:
- Low Clamping Force: Achieves 16W/mK at just 20psi.
- Customizable: Available in thicknesses up to 1mm with optional diffusion barriers to prevent die staining.
5. Phase-Change Metal Alloy (PCMA) TIMs
PCMA TIMs offer the “best of both worlds”—the performance of liquid metal with the ease of high-volume manufacturing.
- Low Melting Point: Solid at room temperature but melts as low as 30°C during operation.
- Volume Control: Easier to apply in automated production lines compared to traditional liquid metals.
Why It Matters for the 2026 Tech Landscape
The shift toward $110 billion semiconductor markets and the rise of AI-driven hardware require materials that don’t just work today, but last for the entire lifecycle of a vehicle or a server. Indium Corporation’s focus on metal-based TIMs reflects a broader industry move away from organic polymers toward materials with higher inherent thermal conductance.
Visit Indium Corporation at SEMI-THERM 2026
- Event: SEMI-THERM 2026
- Dates: March 9–12, 2026
- Location: San Jose, California
- Booth: #303
- Expert Consultation: Meet with Indium’s engineers to discuss custom alloy formulations and diffusion barrier options for your specific application.
For more information on these liquid metal technologies, visit indium.com.
