With APEX 2026 kicking off next week, running March 17–19 in Anaheim, California, the advanced electronic packaging market is anticipating significant breakthroughs in thermal management and soldering technologies. As power electronics, high-performance computing, and electric vehicle (EV) modules grow increasingly complex, the demand for innovative material solutions has never been higher.
At AarokaTech, we continuously track the foundational technologies driving industrial electronics forward. This year, industry-leading materials provider Indium Corporation is set to share vital technical insights across a variety of critical manufacturing topics. Here is a comprehensive preview of the expert-led sessions and technological advancements Indium Corporation will present at the event.
Next-Level Soldering: Eliminating Flux and Mitigating Warpage
The push toward miniaturization and higher power densities requires assembly processes that eliminate harmful residues and thermal stress. Indium Corporation’s researchers are tackling these challenges head-on through advanced soldering methodologies.
Formic Acid Convection Reflow Soldering
Tuesday, March 17 at 11:30 a.m. | Presented by Matthew Schneider, Associate Scientist
Power electronics assemblies are highly sensitive to flux residue, which can compromise long-term reliability. This session will explore formic acid (FA) reflow technology, a cutting-edge fluxless soldering method. By examining fluxless solder pastes formulated with Sn63Pb37 and SAC305 powders, the research highlights impacts on wettability, printability, and voiding performance.
The presentation will detail how gaseous FA penetrates beneath bottom-terminated components, proving its viability for advanced Surface Mount Technology (SMT) and power electronics assembly without the need for post-reflow cleaning.
Bi-Free In-Containing Lower Temperature Solder
Wednesday, March 18 at 5:00 p.m. | Presented by Hongwen Zhang, Ph.D., Senior R&D Manager
Large-format Ball Grid Arrays (BGAs) used in high-performance computing frequently suffer from warpage-induced defects during standard reflow profiles. Dr. Zhang will introduce DFLT, a bismuth-free, indium-containing low-temperature solder paste designed specifically to combat severe warpage.
Operating with a solidus temperature of just 189°C and a lower reflow peak of 210°C, DFLT utilizes a dual-powder design. This session will reveal how this material achieves drop shock resistance two orders of magnitude higher than standard BiSnAg alloys while surpassing the reliability of traditional SAC305.
Breakthroughs in Thermal Interface Materials (TIMs)
Effective heat dissipation is the bottleneck for modern processors and power inverters. Indium Corporation is heavily focused on evolving Thermal Interface Materials (TIMs) to keep high-power components running efficiently.
Liquid Metals as a Thermal Interface Material
Tuesday, March 17 at 3:30 p.m. | Presented by Miloš Lazić, Senior Product Specialist
Conventional thermal greases are rapidly reaching their physical limits in high-volume manufacturing. This presentation provides critical performance data comparing four distinct gallium-based liquid metal TIMs.
Engineers will gain practical guidance on how substrate wetting characteristics influence interfacial resistance, and how liquid metals deliver vastly superior heat transfer, thermal conductivity, and power cycling durability compared to traditional polymer-based greases.
Compressible Metal TIMs for Power Electronic Modules
Wednesday, March 18 at 3:30 p.m. | Presented by Emin Skiljan, Applications Engineering Intern
For automotive, EV, photovoltaic, and industrial applications, attaching a power module to a heat sink requires robust, reliable thermal interfaces. This session investigates the efficacy of patterned indium metal used as a highly compressible TIM.
By comparing ideal lab-setting compression against real-world assembly performance, the presentation will break down thermal resistance, bondline thickness, and pressure distribution, demonstrating how proper mechanical fixturing optimizes heat dissipation in high-power inverter systems.
Optimizing Complex Assembly Processes
Beyond raw materials, Indium Corporation is addressing the practical challenges of modern manufacturing floors, from complex cleaning chemistries to void reduction.
- Advancements in Jettable and Screen-Printable Solder Pastes (Wednesday, March 18 at 4:00 p.m.): Presented by Stephen Pavlik, this session evaluates cleaning process compatibility for novel no-clean solder pastes in miniaturized assemblies. It features Ion Chromatography and SIR testing data to help manufacturers achieve thinner bondlines in intricate electronics.
- Voiding Control Using SAC-In Preform in Paste (Wednesday, March 18 at 5:00 p.m.): A poster presentation introducing a dual-material approach for Quad Flat-Pack No-Lead (QFN) assemblies. By combining reduced-temperature alloy paste with SAC-Indium-enriched preforms, manufacturers can address uneven heating challenges in densely populated boards while maintaining SAC305-level reliability.
Empowering the Manufacturing Workforce
Technology is only as effective as the teams operating the equipment. On Thursday, March 19 at 9:30 a.m., Adam Murling, Technical Services Manager, will moderate a crucial panel titled “Smarter Training for Smarter Machines.” This session dives into the human element of high-tech manufacturing, exploring strategies to close skills gaps, adapt to rapid technological shifts, and scale training content globally to keep complex SMT lines running smoothly.
For engineers and manufacturers looking to stay ahead of the curve, Indium Corporation’s sessions at APEX 2026 offer a roadmap to the future of electronic packaging. Attendees can explore these next-generation solder and thermal technologies in person at Exhibit Hall C-D, booth #1038.
