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  • Home
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  • Semiconductor
    • Vishay IHDV Inductors Launched: Revolutionizing High-Voltage Automotive Power Systems

      June 19, 2026

      New 3-Level Power Semiconductor Modules Set Standard for Industrial Inverters

      June 8, 2026

      Forlinx FET3572-C SoM: The Octa-Core Powerhouse Driving Next-Gen Edge AI

      June 8, 2026

      Semiconductor Circuit Breakers: Infineon and Siemens Revolutionize Power Distribution

      June 8, 2026

      Toshiba TW007D120E SiC MOSFET: Boosting AI Data Center Efficiency

      May 21, 2026
  • Cloud and AI
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    • Kvaser PCIe 4xLIN Launched for Advanced LIN Connectivity

      July 2, 2026

      VIAVI PCIe 6.0 Compliance Testing Gets PCI-SIG Gold Suite

      June 19, 2026

      Siborg LCR-Reader-MPB Tweezers LCR Meter Delivers Benchtop Precision with CAN Connectivity

      June 8, 2026

      VIAVI AI Experts Launched to Accelerate Wireless Test & Validation

      June 5, 2026

      Rohde Schwarz eCall Testing Solution Achieves Milestone Certification for Hybrid and NG eCall

      May 29, 2026
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    • PI3DPX1225A ReDriver Advances USB-C with 13.5Gbps Data Rates

      June 26, 2026

      Infineon AIROC UWB TSL100: Precise Smart Presence Chip

      June 25, 2026

      Infineon CTRX8188F Enters Mass Production: First 8Tx8Rx Automotive Imaging Radar MMIC

      June 24, 2026

      NXP SAF8444 Radar SoC Advances L2+ ADAS Processing

      June 9, 2026

      Murata 2.2μF 100Vdc MLCC: World’s First 0805-Size Soft-Termination Chip

      June 4, 2026
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  • Home
  • Latest Buzz
    • Industry News
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  • Semiconductor
    • Vishay IHDV Inductors Launched: Revolutionizing High-Voltage Automotive Power Systems

      June 19, 2026

      New 3-Level Power Semiconductor Modules Set Standard for Industrial Inverters

      June 8, 2026

      Forlinx FET3572-C SoM: The Octa-Core Powerhouse Driving Next-Gen Edge AI

      June 8, 2026

      Semiconductor Circuit Breakers: Infineon and Siemens Revolutionize Power Distribution

      June 8, 2026

      Toshiba TW007D120E SiC MOSFET: Boosting AI Data Center Efficiency

      May 21, 2026
  • Cloud and AI
    • Cybersecurity
    • IT Technology
  • Test and Measurement
    • Kvaser PCIe 4xLIN Launched for Advanced LIN Connectivity

      July 2, 2026

      VIAVI PCIe 6.0 Compliance Testing Gets PCI-SIG Gold Suite

      June 19, 2026

      Siborg LCR-Reader-MPB Tweezers LCR Meter Delivers Benchtop Precision with CAN Connectivity

      June 8, 2026

      VIAVI AI Experts Launched to Accelerate Wireless Test & Validation

      June 5, 2026

      Rohde Schwarz eCall Testing Solution Achieves Milestone Certification for Hybrid and NG eCall

      May 29, 2026
  • Industry
    • Automotive
    • Renewable Energy
    • IOT
    • Aerospace & Defense
    • Power
    • Sensor
    • Technology
    • Lighting
  • New Products
    • PI3DPX1225A ReDriver Advances USB-C with 13.5Gbps Data Rates

      June 26, 2026

      Infineon AIROC UWB TSL100: Precise Smart Presence Chip

      June 25, 2026

      Infineon CTRX8188F Enters Mass Production: First 8Tx8Rx Automotive Imaging Radar MMIC

      June 24, 2026

      NXP SAF8444 Radar SoC Advances L2+ ADAS Processing

      June 9, 2026

      Murata 2.2μF 100Vdc MLCC: World’s First 0805-Size Soft-Termination Chip

      June 4, 2026
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